2000 -Founded "Dowton Electronic Materials Ltd."
2003 -Successfully develop high temperature conductive paste
2004 -Development of passive components base metal within the process of conductive paste
2005- Development of passive components base metal terminal electrode conductive paste
2005- Through the Bureau of Standards and received ISO9001 / 2008 certification
2006- Development of low temperature conductive paste
2007- Relocate from Yan Chao Township, Kaohsiung County to Nanzih Processing Science Park, Kaohsiung City                  due to further development and expansion.
2008- Officially changed our name to "Dowton Electronic Materials Corporation Ltd."
2009 -Successfully develop low temperature co-fired ceramic special conductive paste
2010- Development of encapsulated conductive paste
2011- Development of fine grained metal electrode conductive paste
2012- Successfully develop bio-chip conductive paste
2013- Successfully develop conductive paste for inductors
2014- Successfully develop low temperature type base metal conductive paste
2015- Development of RF components dedicated terminal electrode conductive paste
2016- Successfully develop precision screen printed conductive paste for resistive components
2017- Successfully develop precision 0.3 micron grade conductive paste for MLCC
2018- Successfully develop precision 0.2 micron grade conductive paste for MLCC
2019- Successfully develop conductive paste and glass paste for ALN substrate
2020- Due to increase demands in automotive and IoT 5G high-frequency applications, Dowton have successfully developed paste design for these applications.